Chip Packaging Design Engineer Job 2024 Full Time

Job Title: Chip Packaging Design Manager

Department: Engineering

Reports to: VP, Hardware Engineering

Who we are:

At Persimmons, Inc., we are pioneering the future of generative AI with our ground-breaking full-stack innovations, including hardware and software integration capable of supporting trillion-parameter models. We are seeking a highly skilled and innovative Chip Packaging Design Manager to lead the design and development of advanced chip packaging solutions. The ideal candidate will have extensive experience in semiconductor packaging design, a strong technical background, and the ability to manage and mentor a team of design engineers.

What you’ll do:

• Lead the design and development of advanced semiconductor packaging solutions for AI hardware.

• Manage and mentor a team of packaging design engineers, providing guidance and technical expertise.

• Collaborate with cross-functional teams, including chip design, manufacturing, and quality assurance, to ensure seamless integration of packaging solutions.

• Develop and implement design methodologies, best practices, and standards for chip packaging.

• Conduct feasibility studies, simulations, and risk assessments to validate packaging designs.

• Oversee the creation of detailed design documentation, including specifications, drawings, and test plans.

• Manage the packaging design lifecycle from concept to production, ensuring timely delivery of high-quality solutions.

• Stay up-to-date with industry trends, emerging technologies, and advancements in semiconductor packaging.

• Interface with suppliers and external partners to source materials and technologies for packaging solutions.

• Ensure compliance with industry standards, regulations, and environmental requirements.

Qualifications:

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, or a related field; advanced degree preferred.

• 7+ years of experience in semiconductor packaging design, with at least 3 years in a leadership or management role.

• Proven track record of successfully designing and developing advanced chip packaging solutions.

• Strong technical knowledge of semiconductor packaging technologies, materials, and processes.

• Experience with packaging design software and simulation tools.

• Excellent problem-solving and analytical skills.

• Strong project management skills, with the ability to manage multiple projects simultaneously.

• Exceptional communication and interpersonal skills, with the ability to collaborate effectively with cross-functional teams.

• Leadership and team management skills, with a focus on mentoring and developing engineering talent.

• Knowledge of industry standards and regulations related to semiconductor packaging.

What We Offer:

• The opportunity to work at the beginning of innovation with some of the most advanced technologies in AI.

• A collaborative environment where innovation is at the heart of everything we do.

• Competitive salary and benefits package.

• Flexible PTO

• 401k

Persimmons, Inc. is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

Please submit your resume and a brief cover letter through our official application portal at https://jobs.ashbyhq.com/persimmons-ai. We kindly request that applicants refrain from contacting our employees directly regarding this listing. Additionally, we do not work with external recruiters for these roles. If a recruiter refers a candidate, no referral fees will be paid, and the referral will be considered voluntary.